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Chemical SOP - Silicon Etching Procedures and Guidelines
This document
outlines basic guidelines for the safe etching of silicon at CHESS.
The intent is to supplement a specific etch procedure so qualified
personnel will accomplish their task in a manner safe to themselves,
and those who later uses the same facilities.
Prepare as
follows: Typical silicon etches contain hydrofluoric (HF)
and other strong acids. Nalgene and/or Teflon holders and
tools must be used. Important: Review and understand
the contents of standard operating procedures and MSDS's that apply
to the chmicals being used.
Before starting to
mix etch ingredients, put the sign on the outside of the CHESS
Chemical Room door stating, "Caution: Etching in progress.
Strong acids in use." Also notify the CHESS Operator, the
CHESS Chemical Safety Officer, or another senior or technical staff
member that you will be working with strong acids. If you need
to leave the chemical room while the etching is in progress, this
person should also be informed and another "Caution:
Etching in progress" sign should be place on the hood sash.
Both signs will be stored in the draw with the glove selection.
Plan what needs to be
done, from start to finish! Silicon can be very smooth and
slippery after etching, so make sure you have the right tools
(basket or tongs) to pick up and handle the finished parts.
All work is done in
the chemistry room fume hood. Check that it is operational and
clear of equipment that you are not using.
In the hood sink, use
the water hose to ensure a continuous cold water flow into an
oversized wash tray.
A timer should be
running and easily read from where you perform the etch.
Personal
Protective Equipment: Wear a Neoprene apron, long pants,
shoes that protect the feet, and a full face shield! Neoprene
gloves should be put on last after they have been thoroughly
inspected to ensure that they are free of any defects. (Although not
required, double gloving with Nitrile gloves underneath is highly
recommended.)
The correct quantity
of etch is based on surface area of the parts and the amount of
silicon to remove. Volume proportions for the typical etchant
used at CHESS are given below. Make only enough for the
job at hand. Mix etch ingredients in the container
used for etching.
The standard room
temperature etch used at CHESS contains 1 part 49% HF mixed into 19
parts concentrated Nitric acid. (For other approved mixtures
of etching solutions, check with Ken Finkelstein or another
qualified CHESS staff member.)
Perform the etch
with the container positioned next to the hood sink.
When etching is
complete place silicon and tools in the overflowing wash tray, and
rinse your gloves.
Remove the silicon
after it is thoroughly washed. From here, handle silicon
outside the hood only.
Clean Up:
Neutralize used etchant: After etch is complete, use
the wash tray, 3/4 full with water, to neutralize used etchant.
From experience, to neutralize 1/2 liter of etch, thoroughly mix 1
cup sodium bicarbonate in the water. (All mineral acids should
be neutralized to a pH of grater than 5.5, before pouring down the
sink. Test with pH paper if necessary.)
Remove
water tube from wash tray but leave water flowing into sink.
Slowly add
small amounts of used etchant to water. After reaction
(bubbling) subsides, stir water and wait until reaction slows.
Repeat this procedure until all etchant has been neutralized.
Some bicarbonate should remain in the wash tray after this process
is completed. If not, slowly and carefully add more sodium
bicarbonate to the wash tray and stir. Sodium bicarbonate may
also be added to bottom of the sink. When any additional
reaction has subsided, dump wash tray. Keep water flowing
throughout.
Finally:
To ensure that all small spills in the hood are neutralized, wipe
the fume hood surface (floor) with a damp paper towel or sponge
covered with bicarbonate of soda. Thoroughly rinse and wipe up
the fume hood floor. Rinse all tools and containers with
water. Wash out the sink and make sure no bicarbonate of soda
remains in the bottom. Wipe down protective gear. Return
all equipment to drying racks and/or its assigned location.
Prepared by:
David J. Jones Date:
9 July, 2001
Last Update:
2006-09-21
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