Th cover image was taken from the journal article "In-Situ Grain Resolved Stress Characterization During Damage Initiation in Cu-10%W Alloy” by Reeju Pokharel et al. The image shows a 3D characterization of a Cu-10%W alloy. A microstructure map, obtained from HEDM measurements, shows the crystallographic grains of W embedded on a
Cu matrix shown in gray. After the initial state characterization, the same specimen was loaded under uniaxial tension to monitor the local stress and strain accumulation due to imposed load. It was observed that high stress triaxiality developed in W grains, which led to decohesion of the Cu-W interface. Upon further loading, the debonded regions grew and coalesced with neighboring pores, eventually leading to macroscopic failure.